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Press Release
                        Media Contact:
                        Aston Bridgman
                        NEC Corporation
                        TEL   :+81-3-3798-6511
                        FAX   :+81-3-3457-7249

*****For immediate use October 30th, 2000

NEC Breaks the 0.10-micron Barrier with CB-130 Cell-Based IC Family and UX5 Process Technology


TOKYO October 30th, 2000 - NEC Corporation (NEC) (NASDAQ: NIPNY) (FTSE: 6701q.l) (TSE: 6701) will begin taking orders from May 2001 for its next-generation CB-130 family of cell-based ICs featuring a gate length of only 0.095-micron, the smallest ever seen in a semiconductor product, that will achieve clock speeds of over 1GHz, power consumption as low as 0.9V and gate counts of up to 62 million. Fabrication of the cell-based ICs will be based on the world's most advanced semiconductor process, NEC's UX5 technology, at the 0.10-micron line at NEC's Yamagata plant that is expected to be operational by 2002.

The UX5 process technology provides the CB-130 family with 1.2V CMOS transistors and all-layer copper wiring together with low-k inter-metal dielectrics (k=2.9) push clock speeds in excess of 1GHz. Additionally, the 0.095-micron gate length allows the CB-130 family to integrate up to 62 million gates in a single device, 1.9 times the gate density of NEC's previous products.

UX5 also introduces a triple-gate oxide film process, and a variety of transistors that correspond to the operating frequency of the circuit being employed, to optimize power dissipation in the CB-130-family without a drop in performance, reducing power consumption by 30% compared to current NEC products. Despite the CB-130 family's low power performance of 0.9V that can allow, for example, an MP3 solid state audio player to run on a single battery at 100mW, NEC is now developing automatic voltage control technology. This technology will supply the most suitable voltage according to the operational status (operating/standby) of the device, adding further power savings.

By offering a number of high-speed interface macros, including SerDes, as the base of these process technologies, NEC is able to provide customers with high-speed chip architectures cultivated in mainframe design. Moreover the use of high-speed, high-capacity memory buffers and NEC's unique 4-transistor cell structure SRAM technology (4T-SRAM: 4 to 16 Mb, up to 400 MHz), NEC has made it possible to incorporate memory with twice the capacity of its conventional 6-transistor SRAM (6T-SRAM). Similarly, advancements with embedded DRAM technology in the graphics market, makes it possible to design chips with up to 256 Mb of onboard memory, a leap that has enabled a comprehensive performance improvement in next-generation products such as servers and routers, leading to the realization of 10Gbps transfer systems.

Explosive growth in the Internet and Internet-related infrastructure is being fuelled by the demand for ever-higher transmission capacity that is in turn raising the need for ultra-high performance devices to an unprecedented pitch. This demand is no longer is focused not only on applications in fixed networking such as network routers, servers and user terminals but also on mobile networking. Mobile networking has extended the emphasis to development of powerful, compact devices that can provide ever-lower power consumption for mobile phones and personal digital assistants among other applications.

The next-generation network society that these developments are forming, is the basis for NEC's vision of an "iSociety". NEC believes that a next-generation Internet society is rapidly evolving as networks quickly convert to broadband and mobile applications to create a world where individuals will not perceive any limits to the networks around them, promoting the exchange of information and knowledge to bring a new creativity in society.

The CB-130 family of cell-based ICs is expected to provide the platform for highly optimized device solutions in these key next-generation broadband and mobile networking areas. In addition to the high speed and low power features enabled by UX5, the CB-130 family is backed by a large-scale, short turn around time (TAT) design environment supporting timing closure, and techniques to circumvent signal integrity problems such as with crosstalk and electromigration, and a range of packaging from flip chips for ultra high pin counts to chips size packages.

NEC expects to release its CB-130 family libraries for performance verification from November 2000 onwards. The company will begin accepting customer orders for the high-performance and standard libraries from May 2001, with sampling from August 2001 and volume production expected from November 2001. Orders for the low-power library are expected to be taken from October 2001 and sampling from early 2002.

In April 2000, NEC began preparations for manufacturing of these advanced devices by 2002, when it announced an 82 billion Yen investment in Fab 5 at its NEC Yamagata, Ltd fabrication facility, for production of devices with copper circuitry and a 0.10-micron design rule. The investment will raise the plant's total capacity to a planned 20,000 wafers at design rules of between 0.15- to 0.10-micron.

About NEC Corporation

NEC Corporation (NASDAQ: NIPNY) (FTSE: 6701q.l) (TSE: 6701) is a leading provider of Internet solutions, dedicated to meeting the specialized needs of its customers in the key computer, network and electron device fields through its three market-focused in-house companies: NEC Solutions, NEC Networks and NEC Electron Devices. NEC Corporation, with its in-house companies, employs more than 150,000 people worldwide and saw net sales of 4,991 billion Yen (approx. US$48 billion) in fiscal year 1999-2000. For further information, please visit the NEC home page at: http://www.nec-global.com


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